By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...
Morning Overview on MSN
This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
AMD has teased the launched of a new Ryzen processor with two chiplets, each of which will include a healthy dollop of 3D V-Cache.
The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...
Instead of semiconductors with parts laid out on a flat surface, they developed a '3D chip' in which layers of parts are stacked vertically. This has resulted in significant improvements, such as a ...
Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...
Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback