Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...

LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...

The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11 billion in 2024 and ...

SEOUL, South Korea, Feb. 2, 2023 /PRNewswire/ -- LG Innotek (CEO Jeong Cheol-dong) is accelerating the business activities in full-scale for targeting the Flip-Chip Ball Grid Array (hereafter referred ...

With Moon Hyuk-soo, CEO of LG Innotek, promoted to president in the 2026 regular executive reshuffle, LG Innotek is still struggling to bear fruit in new businesses. Unlike Samsung Electro-Mechanics, ...

Apple reportedly is in talks with a Korean substrate maker for the supply of ABF-based FC-BGA substrates for processing Apple Car chip solutions, sparking concerns about which IC substrate suppliers ...

BANGALORE, India, Dec. 17, 2025 /PRNewswire/ --Semiconductor Advanced Substrate Market Size The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is ...

Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...