5G chipmakers have placed a lot of attention on supporting new 5G technologies, including 5G-Advanced, satellite non-terrestrial network (NTN) connectivity, 5G fixed wireless access (FWA), and 5G Open ...
Infineon Technologies AG has released the next generation of high-density power modules, supporting AI and high-performance data-center compute. Data centers represent two percent of global energy ...
A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure, cooling systems, and power grids to breaking point. The next generation ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
For extra-powerful, high-efficiency inverter systems in railcars, electric power systems and more Mitsubishi Electric’s SBD-embedded SiC-MOSFET modules, including the 3.3kV/800A version released on ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
AUSTIN, Texas, Sept. 16, 2025 /PRNewswire/ -- Flex Power Modules, a leading provider of advanced power conversion solutions, today announced it is partnering with Renesas to pioneer the next ...
xMEMS Labs has turned its silicon-based micro speakers into something cool. The xMEMS XMC-2400 µCooling chip is an active micro-cooling fan that fits in places where a conventional cooling fan is too ...
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