The U.S. Air Force recently awarded a three-year/$750,000 research grant to the University of Virginia’s (UVA) ExSiTE Lab (Experiments and Simulations in Thermal Engineering) to evaluate the prospect ...
Interesting Engineering on MSN
US scientists develop diamond cooling layer that cuts device heat by 41°F
What started as a fun experiment to create a decorative diamond “owl” for distinguished ...
Available to all on the ATS website, qats.com, these easy-to-use thermal management tools mostly apply to liquid cooling solutions and environmental factors. Cold Plate and Heat Exchanger Selection ...
Represents a key step in market adoption of Chemours’ liquid cooling solution After completing rigorous testing of Opteon™ two-phase immersion cooling fluid, Samsung successfully qualified the fluid ...
A high-density dc-dc converter can deliver substantial power, but only if excessive heat is removed by transferring internal heat through a number of material interfaces to a surface exposed to the ...
With increased electronic minituriztion and the density of the chips running such devices heat is a mortal enemy for the power and scalability of such systems. DARPA today announced a program called ...
"PUE measures how much 'overhead' energy is needed for cooling, lighting and other non-IT systems," Bonte said. "PUE can be ...
SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Cadence® Celsius™ Studio, the industry’s first complete AI thermal design and analysis solution for ...
Cooling System Options for Electronic Enclosure Cooling: Do Thermoelectric Air Conditioners Have the Advantage? This white paper discusses four popular options for cooling electronic/electrical ...
A layer of graphene can reduce the working temperature in hotspots inside a processor by up to 25 percent – which can significantly extend the working life of computers and other electronics. An ...
Global AI growth continues unabated, with Delta Electronics emerging as a key indicator of demand for AI server power and cooling systems. At its latest investor meeting, chairman and CEO Ping Cheng ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results