As IC design complexity and sensitivity rises and operating voltages fall, the use of constant (average) chip temperature models can lead to over-design or multiple design spins. The variation in ...
Power integrity for today’s designs requires accurate modeling of voltage variation across die and efficient coupling between chip/package layouts in a unified platform. March 12th, 2015 - By: Chris ...
Renewable-energy applications, as well as all kinds of energy-efficiency technologies, require reliable, compact, and thermal-efficient power devices. For driving innovation in wind turbines, smart ...
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