POWERSIL Resin 710 is designed for for heat-resistant molded parts that can withstand temperatures above 200°C over long ...
OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it has developed a light diffusion type polypropylene (PP) resin molding compound, called “FULL BRIGHT” *1 PP, which can ...
Master Bond Polymer System EP21TDC-2AN is a two component flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. This system’s exceptional thermal ...