The term "multiphysics" applied to FEA software refers to the simultaneous combination of multiple physical models from different domains — such as fluid, structure, and chemical — to accurately ...

PITTSBURGH, April 24, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a ...

ANSYS Inc ANSS recently expanded its long-standing collaboration with TSMC to transform the semiconductor industry by leveraging artificial intelligence (AI) to advance multiphysics solutions to ...

FAYETTEVILLE, GA, UNITED STATES, December 31, 2025 /EINPresswire.com/ — Artificial intelligence (AI) is increasingly transforming computational mechanics, yet many AI-driven models remain limited by ...

Finite-element-software Comsol Multiphysics 3.3 allows simulating a wide variety of physical phenomena. Finite-element-software Comsol Multiphysics 3.3 allows simulating a wide variety of physical ...

Ansys has collaborated with TSMC to ease the simulation and modeling of EM interactions on wireless ICs manufactured by TSMC. The Ansys multiphysics simulation platform works with TSMC’s N6RF Design ...

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...