LAS VEGAS, NV, UNITED STATES, January 20, 2026 / EINPresswire.com / — CIT (CEO Seung Jeong) announced its participation in CES 2026, the world’s largest IT and consumer electronics exhibition, held in ...

Products still arrive broken, dented, or unsellable because packaging is often designed for ideal conditions rather than real ...

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

European tech company Fresh Inset introduces its Vidre+ Complex application in the US, which is designed to extend produce freshness, quality, appearance and nutrient value, without disrupting brands’ ...

Rethinking the operation could unlock more productivity, and the key to successful automated reverse packaging hinges on ...

CINCINNATI--(BUSINESS WIRE)--ProAmpac, a leader in flexible packaging and material science, announces the launch of ProActive Intelligence Moisture Protect (MP-1000), a patent-pending breakthrough ...

The project seeks to repurpose by-products such as wheat straw and sugarcane residue into paper mailers.

South Korean foundry SK Key Foundry and semiconductor packaging and testing specialist LB Semicon have jointly developed "Direct RDL," a key semiconductor packaging technology that promises to advance ...

Amazon India has partnered with IIT Roorkee to develop recyclable and compostable packaging made from agricultural waste. The ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).