This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ, by Vijayakumar Thangamariappan, Nidhi Agrawal, Jason Kim, Constantinos Xanthopoulos, Ira Leventhal, and Ken Butler, ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

ELECTRONICS: Molex Inc. has announced that three of its socket products have met the stringent criteria for Intel validation. Molex is one of only three vendors whose socket product families are ...

Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...

Series 700, 0518, and 0501 RoHS-compliant sockets are specifically designed for high-pin-count or off-centered components for socketing DIPs with nonstandard row-to-row dimensions and elevating ...