Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...
STEINHAGEN, Germany, Nov. 12, 2025 /PRNewswire/ -- As demand for high-performance power electronics continues to rise across automotive, industrial, and data center applications, manufacturers are ...
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, ...
A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection” was published by researchers at Myongji University. “With ...
STEINHAGEN, Germany, Nov. 12, 2025 /PRNewswire/ -- As demand for high-performance power electronics continues to rise across automotive, industrial, and data center applications, manufacturers are ...
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