5G chipmakers have placed a lot of attention on supporting new 5G technologies, including 5G-Advanced, satellite non-terrestrial network (NTN) connectivity, 5G fixed wireless access (FWA), and 5G Open ...
Infineon Technologies AG has released the next generation of high-density power modules, supporting AI and high-performance data-center compute. Data centers represent two percent of global energy ...
A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure, cooling systems, and power grids to breaking point. The next generation ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
For extra-powerful, high-efficiency inverter systems in railcars, electric power systems and more Mitsubishi Electric’s SBD-embedded SiC-MOSFET modules, including the 3.3kV/800A version released on ...
AUSTIN, Texas, Sept. 16, 2025 /PRNewswire/ -- Flex Power Modules, a leading provider of advanced power conversion solutions, today announced it is partnering with Renesas to pioneer the next ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
xMEMS Labs has turned its silicon-based micro speakers into something cool. The xMEMS XMC-2400 µCooling chip is an active micro-cooling fan that fits in places where a conventional cooling fan is too ...
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