COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series. SAN DIEGO, CA, UNITED STATES, ...
5G chipmakers have placed a lot of attention on supporting new 5G technologies, including 5G-Advanced, satellite non-terrestrial network (NTN) connectivity, 5G fixed wireless access (FWA), and 5G Open ...
The big drivers of 5G mobile network adoption are higher bandwidth, lower latency and higher reliability. For 5G chipmakers, this translates into a need for 5G chips and modules with higher efficiency ...
As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But ...
Why is AI so power-hungry? Vertical vs. lateral power delivery. Details on the Infineon-Delta VPD solution. Infineon expanded its existing collaboration with Delta Electronics to develop ...
AUSTIN, Texas, Sept. 16, 2025 /PRNewswire/ -- Flex Power Modules, a leading provider of advanced power conversion solutions, today announced it is partnering with Renesas to pioneer the next ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
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