The rapid build-out of AI on the edge marks a fundamental shift in where intelligence is located, how much is included in ...

In handwritten digit recognition, it achieved a 90.4% recognition accuracy while reducing input data by 75% “The core of this ...

Mask costs are not stopping leading-edge scaling, but they increasingly influence design, node, and process choices. High-NA EUV will tighten requirements for CD, EPE, local CDU, mask 3D modeling, ...

Chips are getting bigger, more modular, and much more capable as new innovations mix with existing processes and ...

The next power bottleneck is no longer just inside the accelerator — it is the full conversion path from medium-voltage AC to ...

At the heart of CFETs are defect-free epitaxy, ALD dielectrics, workfunction-optimized metals, and perhaps layer transfer.

Semiconductor R&D depends on access to high-quality data, realistic process assumptions, and practical learning from silicon.

As AI clusters push beyond rack-scale limits, optical interconnects and circuit switching are reshaping how data centers scale.

HBM4 allows a customized base die, a capability that primarily targets hyperscalers. Exactly how these projects proceed will vary by project, but the scarce resource is design teams and tools.

Compute clusters bring different parallelization paradigms, such as Tensor parallel, data parallel, context parallel, and pipeline parallel, each with a different network topology requirement.

Bond testing is emerging as a critical control point for long-term performance and yield. As semiconductor devices continue ...

Balancing reliability against cost is becoming more difficult for semiconductor test, as chip complexity increases and devices become more domain-specific. Tests need to be efficient and effective ...