The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to new heights.

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.

The facility’s opening will bolster Micron’s technological edge and solidify SG’s position as a critical player in the global ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM ...

Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company ...

An array of chipmakers are ramping up chip output in Southeast Asia. Last week, Micron announced a US$7 billion plan to make ...

The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...

A US$7 billion Micron advanced packaging facility in Singapore will help manufacture high-bandwidth memory (HBM) chips in ...

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore. The new HBM advanced packaging facility will be the ...

We recently compiled a list of the 12 Most Undervalued Tech Stocks to Invest in Now. In this article, we are going to take a ...

Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore The newest ...