Electronics Engineering Herald - electronics design online …
Read More. ABOUT US. Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, and design tools. EE Herald publishes design ideas, technology trends, course materials, electronic industry related news and news products. E-mail: [email protected]. Tel: +91 9449816029. MAIN LINKS.
Electronics Engineering Herald - semiconductor design news …
India is home to 20% of VLSI design workforce…. 27/01/2024. IESA VS 2024: Roads are laid and paved well leading to India semiconductor fab. Government of India is highly focused in enabling semiconductor…. 25/01/2024. At IESA Vision Summit 2024, IESA launches report on semiconductor and ESDM policies in India.
Electronics Engineering Herald online magazine : New Products …
Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, and design tools.
Imec achieves Cu interconnect pitch of 2µm die-to-wafer hybrid …
Date: 31/05/2024. At the 2024 IEEE Electronic Components and Technology Conference (ECTC), imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic ...
Synaptics' exclusive rights on Broadcom' wireless IP extended till …
Date: 02/08/2023. Synaptics announced that it has added new products and technologies to its wireless license agreement with Broadcom and extended its original 2020 exclusive rights in certain markets by three years to 2026. The deal adds Broadcom’s best-in-class Wi-Fi 7, Bluetooth 6.0, and Bluetooth Enterprise True Wireless Stereo (TWS) IP ...
Back-end semi equipment market is poised for a +32% rebound in …
4 days ago · Yole said back-end semiconductor equipment market faces short-term decline but anticipates recovery with adoption of advanced packaging techniques, where it outlines below points: The back-end equipment market will reach $5.3 billion by the end of 2024. Despite a flat H2 2024, the back-end equipment market is poised for a +32% rebound in Q1 2025.
Chiplet-driven, More-than-Moore way creating exponential …
Dec 7, 2022 · The global market for 3 dimensional semiconductor packaging is estimated around $ 10-12 Billion in the year 2022, with annual growth rate estimated around more than 20%. In 2023, around 10 to 20% of advanced node designs directed towards Chiplet based multi-die packaging applications. There is an extraordinary demand for CAD/EDA design ...
global semi sales in 3Q2024: Up 23.2% y-o-y and up 10.7% q-o-q
4 days ago · Semiconductor Industry Association (SIA) announced global semiconductor sales were $166.0 billion for the third quarter of 2024, an increase of 23.2% compared to the third quarter of 2023 and 10.7% more than the second quarter of 2024. Global sales were $55.3 billion during the month of September 2024, an increase of 4.1% compared to the August ...
Applied to invest 4 billion to set up collaborative semiconductor ...
May 23, 2023 · Applied to invest 4 billion to set up collaborative semiconductor research center Date: 23/05/2023 Semiconductor equipment tool vendor Applied Materials announced investment of US$ 4 billion for next seven years to build what it calls world's largest semiconductor manufacturing research facility, where the leading semiconductor chipmakers, semiconductor ecosystem partners as well as academic ...
New mid-range FPGA from Achronix delivers 12 Tbps of fabric …
4 days ago · With samples available and units already shipped to customers, the AC7t800 delivers the highest level of performance of any mid-range FPGA available in the market today. Features of the AC7t800 include: 2D network-on-chip (NoC) – 12 Tbps of bandwidth. Machine learning processors (MLPs) – 32 x 32 bit fracturable to 4 x 4 bit (INT and FP)